The mCOM10-L1900 is Emerson's rugged COM Express Type 6 computer-on-module built for embedded systems that must operate reliably in harsh industrial and transportation environments. Unlike standard COM Express modules, every variant features soldered-down processor and DDR4 ECC memory — eliminating connector-related failures from shock and vibration — paired with Emerson's patented dynamic thermal management that sustains full performance across the rated temperature range without throttling.

Which AMD Ryzen Embedded processor options are available?

The mCOM10-L1900 series spans the AMD Ryzen Embedded V1000 and R1000 families. The V1000-based variants feature quad-core processors — the V1605B at 2.0 GHz (15 W) for commercial temperature applications and the V1404I at 2.0 GHz (15 W) for industrial extended-temperature deployments. The R1000-based variants offer dual-core options: the R1505G at 2.4 GHz (15 W, 4 threads) for higher per-thread performance, and the R1305G at 1.5 GHz (8 W) for power-constrained designs. All variants integrate AMD Radeon Vega graphics and support up to three independent displays via the carrier board.

What temperature range does each variant support?

Temperature range is the primary differentiator between variants. Industrial models built on the V1404I processor support -40°C to +85°C operation for outdoor installations, railway equipment, and unconditioned enclosures. Commercial variants using the V1605B, R1505G, or R1305G processors are rated for 0°C to +65°C — suitable for factory-floor HMI panels, machine vision controllers, and indoor automation equipment. Each variant maintains full clock speed across its entire rated range thanks to Emerson's dynamic thermal management.

What memory and I/O does the mCOM10-L1900 provide?

What carrier board interface does the mCOM10-L1900 use?

The module uses the COM Express Type 6 pinout on a Basic form factor (125 mm × 95 mm). Type 6 brings native USB 3.1, digital display interfaces (DP/HDMI/DVI), and higher-bandwidth PEG lanes compared to the legacy Type 2 pinout. When designing the carrier board, verify that the chosen variant's TDP aligns with the system's thermal solution — the 15 W quad-core V1000 models require more cooling headroom than the 8 W R1305G.