The Xilinx XC6SLX16-2FTG256C is a member of the Spartan-6 LX (logic optimized) subfamily, providing leading system integration capabilities with the lowest total cost for high-volume applications. Built on 45 nm CMOS technology and operating at a core voltage of 1.2 V, this device delivers up to 667 MHz performance, making it ideally suited for low-cost, high-volume applications including automotive infotainment, consumer electronics, and industrial automation.

Architecture

The XC6SLX16-2FTG256C features 14,579 logic cells organised into 1,139 configurable logic blocks. The device incorporates a new, more efficient dual-register 6-input look-up table (LUT) logic, providing improved logic utilisation and performance compared to previous generations. The Spartan-6 LX subfamily is specifically optimised for logic-intensive applications, offering a rich selection of built-in system-level blocks including DSP48A1 slices for digital signal processing acceleration.

Memory and Clock Management

The device includes 589,824 bits of block RAM, organised as 18Kb (2 x 9Kb) blocks, providing flexible on-chip data storage. Integrated Memory Controller blocks support a wide range of memory interfaces including DDR, DDR2, DDR3, and LPDDR. The clock management tile (CMT) contains two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL), providing enhanced clock management capabilities including frequency synthesis, phase shifting, and clock distribution. The device features up to eight low-skew global clock networks.

I/O Capabilities

The device provides 186 user I/O pins supporting a diverse number of I/O protocols through SelectIO interface technology. The I/Os support single-ended standards including LVCMOS and LVTTL, as well as differential standards such as LVDS. The I/O banks support multiple voltage levels, enabling mixed-voltage system integration. The compact 17 x 17 mm FTBGA-256 package provides an excellent balance of I/O count and board area.

Technical Specifications

Key Features

• Low static and dynamic power consumption with advanced power management
• MicroBlaze soft processor support for embedded processing applications
• BOM cost reduction through integrated system-level blocks
• Auto-detect configuration options with enhanced IP security
• Hot‑pluggable I/O support

Packaging and Environmental

The XC6SLX16-2FTG256C is housed in a 256-pin FTBGA (Fine-Pitch Thin Ball Grid Array) package measuring 17 x 17 mm with a 1 mm pitch. The package is RoHS compliant and lead free. Moisture Sensitivity Level is MSL 3, requiring a floor life of 168 hours after opening. The device is supplied in tray packaging with 160 pieces per tray.

Development Support

Supported by Xilinx ISE WebPACK and ISE Design Suite (ISE 14.7). The device is not supported by the newer Vivado toolchain. For new designs requiring similar density with modern tool support, consider the Spartan-7 family, which offers improved performance and lower power consumption with Vivado compatibility.

Product Status

The XC6SLX16-2FTG256C is currently active and available from distributors. Stock is readily available. For new designs, this device remains a viable option for cost-sensitive applications where legacy tool support is acceptable.