The Xilinx XC6SLX100-3FGG676C is the highest-density member of the Spartan-6 LX (logic optimized) subfamily, offering 101,261 logic cells and 4.9 Mb of block RAM in a 676-pin FBGA package. Built on 45 nm CMOS technology and operating at a core voltage of 1.2 V, this device delivers up to 400 MHz performance, providing a low-cost programmable alternative to custom ASIC products with unprecedented ease of use.

Architecture

The XC6SLX100-3FGG676C features 101,261 logic cells organised into 7,911 configurable logic blocks, representing the highest logic density in the Spartan-6 family. The device incorporates a new, more efficient dual-register 6-input look-up table (LUT) logic, providing improved logic utilisation and performance compared to previous generations. The Spartan-6 LX subfamily is specifically optimised for logic-intensive applications, offering a rich selection of built-in system-level blocks including DSP48A1 slices for digital signal processing acceleration.

Memory and Clock Management

The device includes 4,939,776 bits of block RAM, providing substantial on-chip data storage for complex system designs. Integrated Memory Controller blocks support a wide range of memory interfaces including DDR, DDR2, DDR3, and LPDDR, enabling efficient connection to external memory. The clock management tile (CMT) contains two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL), providing advanced clock management capabilities including frequency synthesis, phase shifting, and clock distribution. The device features up to eight low-skew global clock networks.

I/O Capabilities

The device provides 480 user I/O pins, offering extensive connectivity for high-pin-count applications. The I/Os support a diverse number of protocols through SelectIO interface technology, including single-ended standards such as LVCMOS and LVTTL, as well as differential standards such as LVDS. The I/O banks support multiple voltage levels, enabling mixed-voltage system integration. The 676-FBGA package provides a compact 27x27 mm footprint, balancing high I/O count with manageable board area.

Key Features

• Low static and dynamic power consumption with advanced power management
• MicroBlaze soft processor support for embedded processing applications
• Integrated Endpoint block for PCI Express designs (LXT versions)
• Enhanced security for design protection with AES and Device DNA
• Auto-detect configuration options for flexible system integration

Technical Specifications

Packaging and Environmental

The XC6SLX100-3FGG676C is housed in a 676-pin FBGA (Fine-Pitch Ball Grid Array) package measuring 27 x 27 mm. The package is RoHS compliant (ROHS3) and REACH unaffected. Moisture Sensitivity Level is MSL 3, requiring a floor life of 168 hours after opening. The device is supplied in tray packaging with 40 pieces per tray.

Development Support

Supported by Xilinx ISE WebPACK and ISE Design Suite (ISE 14.7). The device is not supported by the newer Vivado toolchain. For new designs requiring high density with modern tool support, consider the Spartan-7 or Artix-7 families, which offer improved performance, lower power consumption, and Vivado compatibility.

Product Status

The XC6SLX100-3FGG676C is currently active and available from distributors. Stock is available for volume production. For new designs, this device remains a viable option for cost-sensitive applications where high logic density is required and legacy tool support is acceptable.