The Xilinx XC3S200AN-4FTG256I is an industrial-temperature member of the Spartan-3AN FPGA family, combining the features of the Spartan-3A platform with 4 Mb of embedded Flash memory for configuration and nonvolatile data storage. Built on 90 nm CMOS technology and operating at a core voltage of 1.2 V, this device eliminates the need for external configuration PROMs while operating reliably across a wide temperature range of –40°C to 100°C. The suffix “I” indicates industrial temperature range, making this device suitable for applications where commercial-grade devices would be inadequate.

Industrial Temperature Grade

Unlike commercial-grade devices that are specified only from 0°C to 85°C, the XC3S200AN-4FTG256I is characterised for operation from –40°C to 100°C (junction temperature). This extended range is critical for applications in outdoor enclosures, unheated industrial environments, automotive systems (non-engine compartment), telecom outdoor cabinets, and any equipment subject to wide temperature swings. The wider operating range is achieved through more stringent testing and characterisation, ensuring reliable operation under extreme conditions.

Nonvolatile Advantage

The Spartan-3AN family integrates 4 Mb of embedded Flash memory, which stores the FPGA configuration bitstream internally. This eliminates the need for external PROMs, reduces board space, lowers system cost, and enhances design security. The Flash memory can also be used for user data storage, code shadowing, or scratchpad memory in embedded processing applications. The embedded Flash supports robust 100K program/erase cycles, ensuring reliable field updates throughout the product lifetime.

Architecture

The XC3S200AN-4FTG256I features 4,032 logic cells organised into 448 configurable logic blocks (CLBs). The hierarchical SelectRAM memory architecture includes block RAM and distributed RAM, totalling 294,912 bits of on-chip memory. The device includes dedicated multipliers for digital signal processing acceleration and integrated Digital Clock Managers (DCMs) for precise clock management.

I/O Capabilities

The device provides 195 user I/O pins supporting a wide range of single-ended and differential signalling standards through SelectIO technology. The I/Os support 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signalling levels, enabling mixed-voltage system integration. The device features Suspend and Hibernate modes for power management in portable and battery-operated applications.

Technical Specifications

Packaging and Environmental

The XC3S200AN-4FTG256I is housed in a 256-pin FTBGA (Fine-Pitch Thin Ball Grid Array) package measuring 17 x 17 mm. The package is RoHS compliant and lead free. Moisture Sensitivity Level is MSL 3, requiring a floor life of 168 hours after opening. The device is supplied in tray packaging.

Development Support

Supported by Xilinx ISE WebPACK and ISE Design Suite (ISE 14.7). The device is not supported by the newer Vivado toolchain. For new designs requiring industrial temperature range and nonvolatile FPGA technology with modern tool support, consider newer device families such as Spartan-7.

Product Status

The XC3S200AN-4FTG256I is marked as obsolete by DigiKey. Stock is limited and the device is no longer in active production. For existing designs, verify supply availability before committing to volume production.