The R2U2N1C1B2T0F is a high-end configuration of the RXi2-UP platform, built around an Intel Xeon E3-1505L v6 quad-core processor (Kaby Lake, 7th Gen) on Emerson's bCOM6L20 COM Express module. With 32 GB of soldered DDR4-2400 ECC memory, a 256 GB SSD, and 5 Gigabit Ethernet ports — 4 with IEEE 1588/802.1AS hardware time synchronization — it is designed for the most demanding industrial computing workloads on the factory floor.

What workloads justify the Xeon-based UP platform?

The RXi2-UP targets applications where the LP or BP platforms reach their performance ceiling: multi-display HMI/SCADA with high-resolution 3D rendering, real-time analytics processing large streaming datasets, soft PLC or model-based control running alongside visualization, and centralized line controllers aggregating data from dozens of machines. The 2 PCIe expansion slots allow integration of specialized interface cards — motion control, fieldbus, or frame grabber — that cannot be accommodated in the slotless LP or single-slot BP form factors.

How does the RXi2-UP maintain reliability without fans?

Despite the Xeon E3's 25W TDP — substantially higher than the AMD G-Series and Ryzen Embedded processors used in the LP and BP — the UP employs Emerson's patented passive cooling technology that conducts heat from the COM Express module directly to the aluminum housing. The sealed IP20 enclosure eliminates fan intake of conductive dust, coolant mist, and metal particulates common in machining, welding, and foundry environments. Five Gigabit Ethernet ports include one with DASH remote management, enabling out-of-band diagnostics and firmware updates without a local keyboard or monitor.